Presented byTyler Lenzi, Senior Director Micron Technology, Boise, Idaho
Thursday, October 24, at 11 a.m. to Noon in ETRL 101
With the increasing pressures of reduced cost, higher density, improved reliability, andfaster speeds with lower power requirements, engineers are turning to materials scienceto solve some of these challenges. We will explore the trade-offs in the memory marketalong with some of the opportunities. Give examples for some of the scaling that isoccurring, some of the strategies that are used for path finding, and finally what aresome of the outlooks and challenges ahead that still need to be resolved.