Thursday, Oct. 19
11 a.m. – noon in ETRL 101 (Engineering Teaching Research Lab)
Refreshments served in ETRL 119 at 10:30 a.m.
Dr. Peter Borgesen
Professor of Systems Science and Industrial Engineering and of Materials Science, Binghamton University, State University of New York
Deformation and Fatigue of SnAgCu Solder Joints
Abstract
The properties and behavior of the high-Sn alloys currently favored by the microelectronics industry have been the subject of a very large number of studies over the past 2 decades, but a fundamental mechanistic understanding is only now starting to emerge. Realistic solder joints are each the result of a single solidification event, i.e. they are cyclically twinned but have no real grain boundaries. This together with the nature of the β-Sn crystal structure and effects of the unstable precipitate distributions lead to a complex behavior under cyclic loading.
This presentation will outline and discuss a first mechanistically justified model of the fatigue of SnAgCu solder joints under realistic long term service conditions. This includes identification of the dominant inelastic deformation mechanism and the effects of vacancy diffusion on the different crack growth modes in thermal and isothermal cycling. Practical consequences and use will be addressed.
Biography
Peter Borgesen is Professor of Systems Science and Industrial Engineering, and of Materials Science, at Binghamton University. He worked at Riso National Laboratory and received a Ph. D. in Physics from University of Aarhus, Denmark. After 4 years in the Surface Physics Department at the Max Planck Institute for Plasma Physics in Germany and 8 years in the Materials Science Department at Cornell University he joined Universal Instruments Corp. in 1994. There he managed a multi-million research effort funded by an international consortium of major microelectronics companies, focusing on manufacturing processes and reliability. He joined Binghamton University in January of 2009. He has held a visiting position at the University of Bordeaux, France, and served on a range of panels and committees, including the so-called Lead Free Electronics Manhattan Project. Professor Borgesen’s current research is in the area of microelectronics reliability, most recently with an emphasis on flexible hybrid electronics.
